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Автор: Tonich от 13-02-2020, 16:48

LPC802 Data Sheet

The LPC802 are an Arm Cortex-M0+ based, low-cost 32-bit MCU family operating at CPU frequencies of up to 15 MHz. The LPC802 supports 16 KB of flash memory and 2 KB of SRAM.

Автор: Tonich от 13-02-2020, 16:48

LPC546xx Data Sheet

32-bit Arm Cortex-M4 microcontroller; up to 512 KB flash and200 kB SRAM; High-speed USB device/host + PHY; Full-speedUSB device/host; Ethernet AVB; LCD; EMC; SPIFI; CAN FD,SDIO; SHA; 12-bit 5

Автор: Tonich от 13-02-2020, 16:48

LPC51U68 Data Sheet

LPC51U68 Data Sheet

Автор: Tonich от 13-02-2020, 16:48

32-bit Arm Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN

The LPC1769/68/67/66/65/64/63 are Arm Cortex-M3 based microcontrollers for embedded applications operating at CPU frequencies of up to 100 MHz.

Автор: Tonich от 13-02-2020, 16:48

Volansys KW41Z Module Datasheet_Rev0.1

0 BLUETOOTHВ® LOW ENERGY, IEEEВ® 802.15.4 VOL KW41Z MODULE PRODUCT DATA SHEET REVISION V1R1 http://www.volansys.com

Автор: Tonich от 13-02-2020, 16:48

Volansys KW22D Module Datasheet_Rev0.1

1 Copyright Info The information

Автор: Tonich от 13-02-2020, 16:48

Kinetis KV4x: 168 MHz ArmВ® CortexВ®-M4 up to 256KB Flash (100pin)

Kinetis KV4x Data Sheet: 168 MHz high-performance Arm Cortex-M4 microcontroller(MCU), Motor control, up to 256 KB Flash/32 KB RAM (100 pin)

Автор: Tonich от 13-02-2020, 16:48

KMZ80; Programmable angle sensor IC - Datasheet

The KMZ80 is a single channel magnetic angle sensor. Magnetoresistive (MR) sensor bridges and mixed signal IC are integrated into a single package.

Автор: Tonich от 13-02-2020, 16:48

Kinetis KE1xZ with up to 256 KB Flash

Up to 72 MHz ArmВ® CortexВ®-M0+ Based Microcontroller, up to 256 KB flash, up to 32 KB RAM,Kinetis E family to higherperformance and broader scalability

Автор: Tonich от 13-02-2020, 16:48

Kinetis KE1xF with up to 512 KB Flash

The KE1xF microcontroller is built on the ArmВ® CortexВ®-M4 processor with stronger performance and higher memory densities in multiple packages.